ligitek electronics co.,ltd. property of ligitek only pb lead-free parts la287b/g-pf led array data sheet doc. no : qw0905-la287b/g-pf rev. : a date : 18 - oct. - 2007
page 1/5 ligitek electronics co.,ltd. property of ligitek only part no. la287b/g-pf package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 4.6 9.1 2.0 0.5typ - + 3.2 0.5 2.54typ 5.45 7.25 0.5 3.0 0.5 7.4 3.3 3.0 2.4 3.0 5.0 1.0min 28.5min 0.5 typ 2.54typ - + 1.5max lg2340-1-pf
565301.72.680 20 8.0 la287b/g-pf note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. max. forward voltage @20ma(v) typical electrical & optical characteristics (ta=25 ) spectral halfwidth nm peak wave length pnm green diffused color gapgreen emitted material part no lensmin. viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) typ. min. absolute maximum ratings power dissipation reverse current @5v peak forward current duty 1/10@10khz storage temperature operating temperature 10 ir tstg t opr -40 ~ +100 -40 ~ +85 100 pd 120 i fp forward current absolute maximum ratings at ta=25 symbol parameter 30 i f g a mw ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 part no. la287b/g-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/5 part no. la287b/g-pf
60 seconds max ligitek electronics co.,ltd. property of ligitek only page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 260 c3sec max 5 /sec max temp( c) 260 2 /sec max time(sec) preheat 150 100 50 120 25 0 0 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) part no. la287b/g-pf
5/5 page ligitek electronics co.,ltd. property of ligitek only reference standard description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reliability test: test condition test item operating life test high temperature storage test low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 thermal shock test 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 part no. la287b/g-pf
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